IC X-ray Inspection Service ( 2D & 3D)

X ray inspection systems are key tools for failure analysis, quality control, and yield enhancement of Integrated Circuits (ICs), active & passive components, and Printed Circuit Boards (PCBs). In many cases, IC X-Ray Seesrvic (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc. There have been significant improvements in the X-ray inspection capabilities (both 2D and 3D) in the last several years.

3D X-ray or CT X-Ray is a real time completely non-destructive and non-contact failure analysis technique that allows you to view and inspect the external and internal construction of a sample in 3D space. 3D X-Ray works by taking hundreds or thousands of 2D X-Ray images around a 360° rotation on a sample. The proprietary state of art algorithm takes these 2D X-ray images to reconstruct them into a 3D CT volume image. The 3D CT volume image will allow you to view, measure and slice the part at any angle.

3D CT practically eliminates interpretation errors and opens the door to many capabilities; some not available with any other technology.