Failure Analysis Service
Chip Compass Lab provides failure analysis services ranging from Level 1 non-destructive examination to Level 3 fault isolation and root cause identification/analysis and characterization.
SAM
3D X-ray Microscope
3D X-ray
3D Optical Microscope
3D OM
Scanning Acoustic Microscope
Level 1 FA Non-destructive Analysis
Decapsulation
EMMI/OBIRCH/THERMO
Photo Emission
Chemical/Laser decap
Frontside/backside decap
Level 2 Electrical Failure Isolation
FIB
Polish/RIE/Chemical
Focused Ion Beam
Delayer/Parallel Lapping
Polishing/Ion Milling
Cross Sectioning
Scanning Electron Microscope
SEM
Level 3 Physical Failure Analysis
